Industrial electronic enclosures manufacturer ROLEC is making it easier to specify customized housings by offering two different options.
ROLEC is best known for customizing its standard fixed-size enclosures to create unique housings that are ‘PCB-ready’. ROLEC offers this customizing service for diecast aluminum, stainless steel, GRP and plastic enclosures.
All these advanced modern enclosures are IP rated – most of them to IP 66, IP 67 and/or IP 69K – to cope with challenging conditions in heavy industrial, marine and offshore environments. Many models offer ‘lid closed’ installation to protect the seals and electronics. Some have clip-on trims to hide the lid screws, further enhancing the aesthetics.
Models in this range include aluCASE (premium enclosures), aluCLIC (with click-fit mounting), aluDISC (unique round housings), aluPLUS (in industry-standard sizes), aluNORM (multivariable, with space-saving single-channel fixings), conFORM (with built-in RFI/EMI shielding) and aluTWIN (dual chamber).
The other customization option is aimed at the rapidly growing market for tough but elegant HMI panel enclosures for process automation, machine control, Industry 4.0, IIoT and smart factory applications. The enclosures can be manufactured to any customer specified size up to 31.5” x 31.5”, in a wide range of depths and with various rear door options (including no door). They are visually stunning thanks to virtually edgeless flush-mounting front plates.
These IP 65 HMI enclosures are manufactured from aluminum profiles with a choice of aluminum or glass-front panels. Models include multiPANEL (advanced premium command enclosures), profiPANEL (with optional keyboard and mouse trays) and profiPANEL Standard (cost-effective, four standard plan sizes from 15.75” x 15.75 mm to 25.6” x 20.5”, all 3.5” deep). They can be mounted on ROLEC suspension arms, notably the profIPLUS 50 and 70 ranges.
Both options include comprehensive modification services: CNC machining, painting, powder coating, silk-screen and digital printing, engraving, laser processing, RFI/EMI shielding, special materials, membrane keypads, display windows and full assembly.
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